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Penetration Seals

YS-158

MATERIAL
EPDM+Lohmann
PACKAGE
39×26×14cm/50pcs
BASE SIZE
150mm×150mm
PIPE SIZE
15-22mm
N.W
0.8KGS 
G.W
1.36KGS
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Product Description

Modern building envelopes require uncompromising sealing standards, especially at micro-penetrations. Small-diameter elements such as split-system HVAC line sets, solar thermal conduits, and exterior electrical cabling present localized water ingress risks. Traditional heavy-duty flashing boots are geometrically incompatible with these tight spaces, leading to inadequate field modifications that compromise sealing integrity.

The YS-158 micro-flashing, manufactured under the Yombo brand, provides a highly engineered solution specifically for penetrations ranging from 15 mm to 22 mm in diameter.

Material Synthesis & Core Technology

The structural efficacy of the YS-158 relies on a specialized composite design:

Premium EPDM Sealing Collar: The central sealing cone is molded from high-density Ethylene Propylene Diene Monomer (EPDM). This polymer provides outstanding resistance to ozone degradation, UV exposure, and thermal cycling, maintaining its elastic recovery across a broad temperature range.

Integrated Lohmann Adhesive Technology: The 150 mm x 150 mm base utilizes a premium adhesive carrier from Lohmann. This high-tack, industrial-grade tape guarantees immediate, structural adhesion to clean metal, vapor barriers, or underlayments without mechanical fasteners.

Technical Specifications

Product Model: YS-158

Applicable Pipe Diameter: 15 mm to 22 mm

Base Dimensions: 150 mm x 150 mm

Material Composition: High-Performance EPDM + Lohmann Industrial Adhesive

Compliance & MOQ: RoHS Compliant, 100 Units Minimum

Performance Limiters & Best Practices

Surface preparation dictates the ultimate longevity of the Lohmann adhesive interface. Installers must thoroughly clean substrates of dust, oils, and moisture before applying the YS-158. Uniform pressure should be applied across the entire 150 mm x 150 mm perimeter to activate the pressure-sensitive adhesive and prevent micro-channel void formation.

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